|
Capability
|
Line card
|
Backplane
|
Server
|
HDI
|
Rigid-flext board
|
|
Layer
|
2-40
|
2-56
|
20-40
|
4-30
|
4-20
|
|
Board thickness (mm)
|
0.3-5.0
|
1.0-10
|
2.5-5.7
|
0.4-4.0
|
0.4-3.0
|
|
Board size (mmXmm)
|
600×1180
|
600×1180
|
785*475
|
610×475
|
580×420mm
|
|
Copper thickness of inner layers (OZ)
|
T-5
|
H-5
|
H-5
|
H-4
|
T-1
|
|
Hole wall thickness (µm)
|
20-70
|
20/18, 25/20
|
20/18, 25/20, 25/28
|
20/18, 25/20
|
20/18，20/25
|
|
Finish copper thickness of outer layers (OZ)
|
1-5
|
1-5
|
1-5
|
1-2
|
1-2
|
|
PCB types
|
Lead free (mid and high Tg), halogen-free, high frequency (hybrid, PTFE, etc.), high speed (mid loss, low loss, very low loss, ultra low loss，etc.), PI, buried capacitance, buried resistance
|
|
Trace width/spacing of inner layer (mil)
|
2.4/2.4
|
3/3.5
|
3/3
|
1.6/1.6
|
1.6/1.6
|
|
Trace width/spacing of outer layer (mil)
|
3/3
|
4/5
|
3/4
|
3/3
|
3/3
|
|
Mini. Drill bit (mm)
|
≥0.15
|
≥0.2
|
≥0.2
|
≥0.15
|
≥0.15
|
|
Laser hole size (mm)
|
≥0.075
|
/
|
/
|
≥0.075
|
≥0.075
|
|
PTH hole aspect ratio (max.)
|
40/1
|
40/1
|
30/1
|
25/1
|
25/1
|
|
Surface treatment
|
Lead free HASL, ENIG, Immersion Tin, Immersion Ag, Gold finger, OSP+ENIG
|
|
Structure
|
Through-hole, 3+N+3
|
/
|
3+N+3
|
3+N(N+M)+3
|
|
NR-2F-NR
|
|
2F-NR
|
|
NR-4F-NR(PP bonding)
|
|
Air gap(2 cavities)
|
|
|
Special products
|
|
Embedded PCB
|
Buried capacitance, Buried resistance, Embedded daughter board, Embedded magnetic cores. Etc
|
|
Step board
|
PTH step board, NPTH step board, step gold finger board, graph in bottom of step
|
|
Heat dissipation board
|
Post bonding, Sweat soldering, embedded coin, embedded ceramic
|
|
High density board
|
2 trace through 0.9mm BGA pitch（one hole back drill）, 6mil through hole backdrill（D+6）, high depth laser hole, (AR=0.8)0.65mm BGA pitch
|
|
Other special board
|
POFV (VIPPO), hybrid, local hybrid, long-short gold finger, Plating side of board, N + N structure, double side press fit hole, thick copper, etc
|
